AdvancedMEMS team has more than 15 years combined experience performing MEMS fabrication many of the major national labs. Currently the majority of our prototyping and single-step processing work is done at the UC Berkeley Microlab.
We work in a 10,000sq ft clean-room with full MEMS and CMOS capabilities for 4" and 6" wafers. Process equipment includes mask-making, photolithography (contact, i and g-line steppers as well as deep UV and nano-imprint capabilities), wet etch, RIE, DRIE, thin film deposition, oxidation, metallization, CMP, dicing and packaging. View a full list of equipment here, or contact us to discuss specific capabilities.
We are experienced in all areas of MEMS fabrication, including wafer level bonding, deep reactive ion etching, through-wafer etching and backside alignment.
Sample projects areas include:
Should you wish to utilize the Berkeley Microlab, we are certified to train you on all machinery.
Additionally, we have close ties to full-scale production foundries and can help you transfer your designs to their processes as well as ensuring that your devices are designed for manufacturability.